Hacker News: heidne32https://news.ycombinator.com/user?id=heidne32Hacker News RSShttps://hnrss.org/hnrss v2.1.1Thu, 25 Jun 2026 05:21:47 +0000<![CDATA[New comment by heidne32 in "Show HN: CleverCrow: give tokens to your favorite projects"]]>In your mind this sounds like “damn kids, get off my lawn”, and to the kids it sounds like, “I will only ever plow my fields with donkeys, tractors are too complex for something like plowing”.

]]>Mon, 22 Jun 2026 21:17:26 +0000https://news.ycombinator.com/item?id=48636332heidne32https://news.ycombinator.com/item?id=48636332https://news.ycombinator.com/item?id=48636332<![CDATA[New comment by heidne32 in "Apple to Raise Prices Due to Memory Chip Crunch"]]>No; that’s absurd to say it’s physically impossible, it is absolutely possible to etch whatever arbitrary pattern into a physical substrate, physics pending. What is true is that the CPU and DRAM fabrication processes are very unalike, one uses highly complex patterning for the logic, the other uses many blocks repeated for memory, and can be done on a higher process node as it does not require the same intricacy's. It’s not cost efficient to use logic fabrication to make memory. And you won’t get the yield with highly complex patterning for logic from something that is meant to stamp out the same DRAM block billions of times.

So one day, when we have process nodes far smaller what we do today, a DRAM fab can print highly complex patterning for logic, compatible to today’s CPUs on die. And the logic fabs will be making cpus many times more complex than that. Because economics.

]]>Thu, 18 Jun 2026 05:19:03 +0000https://news.ycombinator.com/item?id=48581131heidne32https://news.ycombinator.com/item?id=48581131https://news.ycombinator.com/item?id=48581131